The function of the heater plate for deposition equipment is to heat the substrate or wafer, as well as ensure this process being carried out at the desired temperature with precise temperature uniformity. Because of the outstanding characteristics, heater plate for deposition equipment made from aluminium nitride ceramics is suited for high temperature environments and situations that call for excellent electrical insulation. The following shows several advantages of the aluminum nitride heater plate for deposition equipment.
High Thermal Conductivity
AlN ceramics possess high thermal conductivity, which enables them to heat the substrate or wafer quickly by swiftly transferring heat to the heater plate. AlN ceramics' excellent thermal conductivity guarantees that the substrate or wafer is heated uniformly, leading to better process control and enhanced product quality.
Plasma Resistance
Plasma is an ionised gas that is frequently utilized in various industrial processes like plasma etching and thin film deposition. However, because of their great energy and reactivity, plasmas can seriously harm materials. Therefore, selecting materials that can endure the harsh conditions of plasma is crucial. Aluminium nitride ceramics have exceptional plasma resistance due to their distinctive crystal structure, which makes them the perfect material for heaters for deposition equipment.
Outstanding Thermal Stability
In the production of semiconductors, it's crucial to maintain precise and consistent temperatures during the procedures like annealing, deposition, and etching. The thermal stability of aluminium nitride ceramics prevents defects from forming in thin films or coatings by ensuring uniform heating of the substrate and source material. Uneven heating of the substrate might cause some areas to be hotter or colder than others, which can result in uneven film characteristics.
Chemical Resistance
In harsh chemical conditions, semiconductor heater plates are frequently used. AlN ceramic offers exceptional chemical resistance, meaning it can withstand corrosive chemicals and high temperatures, thereby extending the service life of the heater plate for deposition equipment.
High Mechanical Strength
AlN ceramics have extremely high mechanical strength and are resistant to thermal stress and mechanical shock. As a result, it is an ideal material for high-temperature conditions and applications that require excellent thermal insulation and mechanical stability.
Aluminum nitride ceramics will continue to be the preferred material as semiconductor manufacturing processes become increasingly complex and demanding, increasing the demand for high-quality and dependable heater plates. Unipretec’s heaters are engineered to specific OEM requirements for up to 300 mm wafer diameters.
Features
High efficiency and uniform heat distribution
A excellent thermal conductor and efficient, evenly distributed heater, the CVD coated aluminum heating plate can guarantee a constant temperature of the hot surface and remove hot and cold spots from the equipment.
Good thermal insulation performance and a long life
Good thermal insulating characteristics and a long service life characterize this heating plate.
High purity materials
For procedures that need for regulated and predictable heating curves, 99.99% high purity pyrolytic boron nitride ceramic heating plates, for instance, are made to distribute heat uniformly and maintain constant temperature throughout the whole surface.
Applications
Semiconductor processing
Uniformly heating silicon wafers, enabling high-precision reactions on the substrate surface, and producing thin layers, ceramic heating plates are an essential part of the semiconductor manufacturing process.
Deposition of chemical vapours (CVD)
The fundamental idea behind CVD equipment is to create solid thin films on the substrate surface by use of chemical interactions between gaseous reactants at high temperatures. The required materials are progressively deposited into films after chemical reactions on the heated substrate surface are initiated by the reactants that are carried to the reaction chamber by carrier gas.
Dimensions technical
Accuracy of temperature control: The new electric heating plate satisfies the temperature control needs of different samples by using a PID intelligent program temperature control system with an accuracy of ±0.2℅.
Heating uniformity
Usually separated into direct resistance heating and indirect resistance heating, the heating plate may provide both local and overall uniform heating.
Further characteristics
Unitary construction
The resistance heating and stacked hot plate technological foundation of the MBRAUN hot plate stacking system design. It combines reasonably priced, high-production-efficiency, modular, small equipment.
Many-purpose application
Numerous fields, including heat treatment, thermoforming, welding, metal smelting, frequency heating machines, etc., extensively employ heating plates.
