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Aluminum nitride has a number of excellent properties, including exceptional thermal conductivity, dependable electrical insulation, low dielectric constant and dielectric loss, non-toxicity, and a thermal expansion coefficient that matches silicon, making it a material of great concern in the field of electronics. Additionally, it is ideal for the new generation of heat-dissipating substrates and electronic device packaging.
Traditional ceramic materials, such as Al2O3, can no longer fulfill current demands due to their low thermal conductivity, which is approximately one-fifth that of AlN ceramics, and their linear expansion coefficient does not match Si. BeO and SiC ceramic substrates also have relatively high thermal conductivity; however, BeO is highly poisonous and SiC has poor insulation. As a result, AlN has emerged as an excellent material for replacing Al2O3, SiC, and BeO ceramic substrates used in the electronics industry.
Aluminum Nitride Substrate-Tape Casting
Advanced molding process, tape casting, is employed. This method has the features of high production efficiency, low cost, consistent green body performance, stable process, etc. It can produce products with standard thermal conductivity ≥170W/m.k, substrate thickness ranging from 0.25 to 1.0mm, and products with special specifications can be customized in accordance with customer needs. Moreover, customized grinding sheets, polishing sheets, and laser scribing sheets with high thermal conductivity are available.
Common Sizes of Aluminum Nitride Sheet Tape Casting
| Product | Thickness | Length Width Dimension |
| Aluminum Nitride Ceramic Substrate | 0.38 | 101.6*101.6;114.3*114.3;110*110;120*120;127*127;140*190 |
| 0.5 | ||
| 0.635 | ||
| 0.76 | ||
| 1 | ||
| 1.2 | ||
| 1.5 |
Ordinary casting ceramic substrates are frequently used in ceramic metallization, like DPC (Direct Plating Copper), DBC (Direct Copper Bonding), AMB, thin film, and thick film. These metallization processes contribute to their application in high power LED industry, radio frequency resistor, and high power IGBT modules.
Aluminum Nitride Substrate-Dry Pressing
Aluminum Nitride Substrate produced by cutting-edge dry pressing technique can achieve good insulating property, high mechanical strength, good toughness, non-toxicity and safety, and can meet EU environmental protection requirements. The maximum size can reach 450mm, and the thickness ranges from 1.5 to 20mm. The shape and specification can be tailored to the needs of customers.
Common Sizes of Aluminum Nitride Dry Pressed Sheet
| Thickness | Specification | |
| Aluminum Nitride Disc | 1.5 | Φ16 Φ19 Φ20 Φ26 Φ30 φ35 Φ40 Φ45 Φ50 Φ55 Φ60 Φ65 Φ70 |
| 2 | ||
| ...... | ||
| 10 | ||
| Square Plate | ＞3.0 | 54*54；100*100；150*140；300*300 |
High Thermal Conductivity Aluminum Nitride Substrate-200W/m.k & 230W/m.k
The demand for high heat dissipation materials grows as product designs get smaller and the power becomes larger. Unipretec offers aluminum nitride substrates with high thermal conductivity of 200W/m.k and 230W/m.k. In the field of laser devices, aluminum nitride with high thermal conductivity is extensively used at present.
Common Sizes of High Thermal Conductivity Aluminum Nitride
| Thermal Conductivity | Thickness | Length Width Dimension |
| 200W/mk | 0.33 | 50.8*50.8; 76.2*76.2; 101.6*101.6; 114.3*114.3; 120*120 |
| 0.38 | ||
| 0.5 | ||
| 0.635 | ||
| 1 | ||
| 230W/mk | 0.3-0.5 | 50.8*50.8; 76.2*76.2; 101.6*101.6; 114.3*114.3 |
Aluminum Nitride Substrate-Grinding & Polishing
Advanced equipment and testing instruments can be used to grind single or both sides of the product to achieve the desired surface roughness for the customer. The surface of the ground and polished substrate is flat and smooth, making it suitable for creating thin film circuits and widely used in products that need delicate wiring. Currently, grinding and polishing products are frequently employed in thin film metallization for the field of optical communication devices.
Grinding and Polishing Surface Roughness
| General Lapping Plate | Ra0.3-0.6 |
| Fine Lapping Plate | Ra0.1-0.4 |
| Polishing Plate | Ra0.03-0.05 |
Aluminum Nitride Substrate-Laser Processing
Laser processing enables the pre-cutting, drilling, grooving, and other processing processes of aluminum nitride substrates. Pre-cutting lines can be achieved in advance through laser processing, which is advantageous for creating metal circuits and post-splitting. Additionally, it can fulfill the requirements of product conduction, achieving the metal conduction capability on both sides of metallization. Furthermore, we can also follow up on customer's special-shaped structure requirements, enabling a variety of irregular shapes.
Laser Processing Sheet Tolerance
| Internal Dimension Tolerance | ±0.03-0.05 |
| External Dimension Tolerance | ±0.1-0.15 |
| Hole(φ0.07-0.15）Tolerance | ±0.02-0.05 |
| Hole(aboveφ0.15）Tolerance | ±0.05-0.1 |
Aluminum Nitride Structural Ceramics
Aluminum nitride structural ceramics are manufactured using aluminum nitride atomising spray powder, and are fired following dry pressing, isostatic pressing, and other processes. They are resistant to high temperatures and corrosion, possess excellent mechanical characteristics, high hardness, and superior toughness than Al2O3 ceramics. Taking advantage of their heat and corrosion resistance, AIN ceramics can be used to manufacture high-temperature and corrosion-resistant components such as crucibles, Al evaporation dishes, and electrostatic chucks for semiconductor wafer machining.
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>>> Aluminum nitride (AlN) is a high-performance technical ceramic material that is renowned for exceptional thermal conductivity, electrical insulation, and great mechanical strength. It is a compound of aluminum and nitrogen and is frequently employed in situations where efficient heat dissipation is important.
>>> Yes, due to the cost of the raw materials and the manufacturing process, aluminum nitride ceramic is always more expensive than some other ceramics. However, for applications where its special properties are essential, the cost is justified.
>>> Yes, aluminum nitride ceramics can be machined using techniques of grinding, milling, and drilling. However, because it is a hard and brittle material, it requires specific handling and equipment.
>>>
- Electronic device substrates: AlN ceramics can be used as substrates for high-power electronic devices such as power transistors, LEDs, and laser diodes.
- Heat sinks: AlN ceramics are employed in heat sinks to effectively dissipate heat produced by electronic components.
- Microwave components: AlN ceramics find application in microwave components like insulators, resonators, and waveguides.
- Semiconductor processing equipment: AlN ceramics are used as chucks and clamp rings for semiconductor processing equipment and the handling and processing of silicon wafers.
- LED packaging: AlN is used in LED packages to assist thermal management.
>>> In its solid ceramic form, aluminum nitride is generally regarded as safe. The dust or particles produced during machining or processing, however, can pose inhalation risks like many other materials, hence appropriate safety measures should be taken in such circumstances.
>>> Aluminum nitride can withstand exceedingly high temperatures. It has a melting point of 2200°C, and can function at temperatures considerably above 1000°C in various applications.
>>> Aluminum nitride is frequently employed in the manufacturing of electronic components such as diodes, transistors, and integrated circuits. Contrary to conventional semiconductors like silicon, it can work at greater temperatures and voltages thanks to its wide bandgap. In addition, AlN is advantageous for situations where efficient heat dissipation is significant because of its high thermal conductivity.
Alumina (Al2O3)
Alumium Niride (AlN)
Boron Nitride (Hex BN)
Machinable Glass Ceramic
Silicon Nitride (Si3N4)
Zirconia (ZrO2)
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