Ceramic Substrate

There are numerous types of ceramics, but three stand out as substrate materials in particular. These are alumina (Al2O3), aluminum nitride (AlN), and silicon nitride (Si3N4). They offer high thermal conductivity, good electrical insulation, and high-temperature resistance.

Ceramic Substrate Introduction

96% Alumina Substrate
96% Alumina (Al2O3) substrate is considered as one of the most cost-effective substrate materials. It possesses comprehensive properties of outstanding strength, good thermal conductivity, and stable electrical insulation. Another characteristic that makes it suited for both thin film and thick film metalization is its smooth surface. 96% alumina substrate is widely utilized in LED packages, chip resistor substrates, HIC substrates for heat dissipation, high-frequency power electronics, and other applications.

● Good surface roughness and can be polished to achieve mirror-like effect;
● Fast delivery, cost-effective, and the performance is stable;
● Fast heat dissipation, no hot spots left on the board device;
● No warping or bending in hot environments;
● Stable insulation performance, high resistivity, low dielectric constant;
● No moisture absorption issues occur, allowing it to be an excellent choice for marine and automotive power electronics applications.

99.6% Alumina Substrate
The standard for thin-film substrates is 99.6% alumina, which is frequently utilized for sputtering, evaporation, and chemical vapor deposition of metals to create circuits. The material is smoother and has fewer surface flaws thanks to the high purity of 99.6% alumina and the smaller grain size, resulting in a surface roughness of Ra0.1-0.3um. 99.6% alumina provides excellent electrical insulation, low thermal conductivity, great mechanical strength, outstanding dielectric characteristics, and good resistance to wear and corrosion.

Aluminum Nitride Substrate
Aluminum Nitride (AlN) substrate is an outstanding material that not only meets the requirements of high thermal conductivity but is also electrically insulating. It can swiftly disperse heat to keep electrical systems operating at their peak efficiency. Furthermore, unlike Beryllium Oxide (BeO), AlN substrate is safe to manufacture and machine. Additionally, its coefficient of thermal expansion is comparable to that of silicon material, although it performs better at high temperatures and heat dissipation than silicon. All of these features contribute to the widespread use of aluminum nitride substrate in power and electronics applications. It is particularly useful as a circuit substrate in semiconductors, LED lighting technologies, or high-power electronics.

●Fast heat dissipation
●No softening or distortion when running at a high temperature
●Low thermal expansion coefficient, which is similar to that of silicon
●Excellent plasma resistance
●Excellent resistance to thermal shock

Silicon Nitride Substrate
The remarkable mechanical, thermal, and electrical properties of silicon nitride substrate make it a valuable material for a variety of applications. In the semiconductor and electronics sectors, as well as in cutting-edge engineering and research fields, silicon nitride substrates are frequently employed. They are ideal for integrated circuit packaging and high-temperature sensors because they exhibit high thermal conductivity, superior electrical insulation, thermal shock resistance, and mechanical durability. Silicon nitride substrates are essential in contemporary technology and manufacturing processes because of their versatility.

Metalized Ceramic Substrate
Ceramic substrates can be metallized through various techniques, and several common methods include Direct Bonded Copper (DBC), Direct Plated Copper (DPC), and Active Metal Brazing (AMB).

DBC Ceramic Substrate
Direct Copper Bonding (DBC) ceramic substrate is a new composite material that consists of a copper metal coating on a highly insulating aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate. The copper metal is oxidized and diffused by high-temperature heating to generate a eutectic melt with the ceramic, resulting in metal bonded ceramic substrates; and lastly, circuit substrates are produced. They are primarily used in high-temperature gaskets, chilling plate, and packaging of power semiconductor modules.

DPC Ceramic Substrate
Directly plated copper (DPC) ceramic substrate involves the process of coating a high-insulating ceramic substrate with copper metal using magnetron sputtering, followed by etching circuit patterns on the ceramic substrate through activation sputtering, and exposure and development. The combination of metal and ceramic is thickened through electroplating, and the line precision is increased while the line distance is decreased. The DPC ceramic substrates are commonly used in industries including semiconductor equipment, microwave wireless communications, and high-brightness and high-power LEDs.

AMB Ceramic Substrate
Active metal brazing substrate (AMB) is a method of welding on ceramics using active metals. The AMB substrate is made of insulating ceramic or silicon nitride (Si3N4), and a high-temperature vacuum welding technique is used to weld pure copper to the ceramic. It is possible to generate metal-ceramic composite materials with stable mechanical characteristics and excellent thermal conductivity, which are mostly utilized in electronic components and circuits with high demand.

Applications of Ceramic Substrate
Sintering equipment
Ceramic package of automotive electronics
High-temperature heating element
Substrate for chip resistors
HIC substrates for heat dissipation
Power modules
Integrated circuit package
Semiconductor manufacturing devices
High-frequency circuits
LED package
Wafer bonding
Optical module submount
Ferrite microstrip circuit

Ceramic Substrate

DBC Ceramic Substrate

DPC Ceramic Substrate

Alumina Substrate

Aluminum Nitride Substrate

Al2O3 Substrate

AlN Substrate

99.6% Alumina Substrate

Silicon Nitride Substrate

Ceramic Substrate Applications

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DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules must exhibit excellent properties in terms of heat sink dissipation, and thermal and power cycling tolerance. Ceramics have a large heat capacity and great thermal conductivity. The exceptional electrical and thermal conductivity of thick copper foil lays a good foundation for welding and wire bonding technology. UNIPRETEC ensures that the numerous materials used in assembly and packaging technology are perfectly matched to the substrate, its functional surface, and the chip attachment.

Zirconia Ceramic

FAQ'S

For more complex items, we should be able to respond within 24 or 48 hours. If you have any other specific question on any of our products or services, please contact us by email [email protected] or by telephone +86 592 5510319.

Q1: How are the ceramic substrates machined?

>>> We employ 100% laser technology. This is the most effective method for ensuring precise and clean milling and drilling of the ceramic.

Q2: Can you do laser scribing?

>>> Yes. In order to generate a weak spot in the material and guarantee a clean cut when breaking out, laser scribing involves drilling numerous blind holes along a line. We have a full page devoted to this technology.

Q3: How can I single out a panel?

>>> If you decided to add laser scribing, you can just use manual force to separate each design from a panel. It will take some practice at first, but after a few rounds, it will be quite fast. You will observe that designs break along the scribing line. Always remember to cut the shortest scribing lines first. If you're not sure, make a small jig that holds the rest of the panel in place while snapping off each designs.

Q4: Why choose ceramic substrate over traditional substrate?

>>> Traditional substrate materials typically have low Tg (usually lower than 170°C), low coefficient of thermal expansion (CTE), and low thermal conductivity. Hotspots appear on the board as a result of poor conductivity. Low CTE causes differential expansion between board and copper layers, traces, solder junctions, and components. Additionally, a low Tg indicates that the board can soften and deform at rather low temperatures. However, ceramic substrates are significantly superior heat conductors, meaning they are greatly more effective at transferring heat from board devices to heat sinks. This also keeps local hotspots from forming. In order to prevent substrate deformation in high-temperature environments, ceramic substrates are also high-temperature resistant.

Q5: Can ceramic substrates be customized in terms of size and shape?

>>> Yes, ceramic substrates can be produced in a variety of sizes, shapes, and thicknesses to satisfy the needs of certain applications.

Q6: What are the considerations when choosing a ceramic substrate?

>>> Thermal conductivity, electrical insulating properties, mechanical strength, chemical compatibility, and the particular needs of your application are all factors to take into account.

Q7: What is the cost range for ceramic substrates?

>>> The cost is determined by factors such as material type, size, thickness, and customization. In general, alumina substrates are more cost-effective than aluminum nitride substrate and silicon nitride substrates.