DBC Ceramic Substrate

DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules must exhibit excellent properties in terms of heat sink dissipation, and thermal and power cycling tolerance. Ceramics have a large heat capacity and great thermal conductivity. The exceptional electrical and thermal conductivity of thick copper foil lays a good foundation for welding and wire bonding technology. UNIPRETEC ensures that the numerous materials used in assembly and packaging technology are perfectly matched to the substrate, its functional surface, and the chip attachment.