99.6% Alumina Substrate

99.6% Alumina Substrate

Unipretec offers 99.6% alumina substrates. This high purity alumina substrate exhibits excellent physical, chemical, and mechanical properties, including exceptional insulating properties, high thermal conductivity, low dielectric constant, low dielectric loss, high flexural strength, high wear and corrosion resistance, and is widely produced for the thin film circuits industry, used in radio frequency components, optoelectronic components, and electronic packaging.

99.6% alumina ceramic substrates are manufactured from raw materials that are at least 4N grade high-purity alumina. Each production process necessitates tight quality control and meets various performance requirements for integrated circuits. R&D and production of such high-end precision products require a technical team with a specific technological foundation, ranging from the design and production of materials to the downstream applications.

Properties of 99.6% Alumina Substrate

• High purity, extremely smooth surface, high finish, no holes;

• The grains have a solid structure and are exceedingly fine and uniform;

• The dielectric constant is stable and uniform;

• Low dielectric loss, and effective insulation.

 

According to purity, alumina ceramic substrates can be separated into 96 alumina and 99.6 alumina. The most significant features are low dielectric loss, low and stable dielectric constant, high mechanical strength, and great chemical stability. Although the mechanical properties and thermal conductivity alter significantly with different alumina contents, their electrical characteristics remain mostly unaffected. Low purity substrates feature more glass phases and have larger surface roughness; higher purity substrates are smoother, denser, and have lower dielectric loss, but they are also more expensive.

 

In terms of material selection, for instance, an alumina ceramic sheet with a purity of 99.6% has a dielectric constant of 9.9, while the one with a purity of 96% has a dielectric constant of 9.6. Even if the difference in dielectric constant is only a few tenths, it is already a significant error in microwave RF design. Devices manufactured of 99% and 96% alumina ceramic could have a qualitative difference in electrical properties because of their slightly varying dielectric constants. In general, the higher the purity, the higher the cost of alumina ceramic substrates.

 

General Dimension of 99.6% Alumina Substrate

99.6% Alumina Substrate

 

99.6% Alumina Substrate-Lapping/Polishing

99.6% Alumina Substrate

 

Manufacturing Methodology

Making 99.6% alumina substrates requires a few important procedures.

Preparing Raw Materials

Most of the time, sources of high-purity alumina powder are aluminum oxide or hydroxide. The powder is chosen with attention for particle size distribution and purity.

Sizing

Mixing the alumina powder with binders and additives, it is then formed into green bodies by dry pressing, extrusion, or slip casting.

Sintering

Usually carried out in a controlled environment furnace at temperatures exceeding 1600°C, the green bodies go through a high-temperature sintering process. Particles of alumina combine during sintering to create a dense ceramic structure with the required thermal and mechanical characteristics.

Finishing

The alumina substrates may need further machining procedures like grinding, polishing, and laser cutting to get exact measurements and smooth surface finishes after sintering.

 

Using 99.6% Alumina Substrates

99.6% of alumina substrates have a wide range of uses in many sectors, such as:

Technology

They are utilized as insulating components in electronic assemblies needing high performance and durability, substrates for semiconductor devices, and thick film circuits.

High Temperature Components

Alumina substrates find use in high-temperature applications like furnace heaters, kiln components, and thermal insulators because of their mechanical strength and thermal stability.

Medical and Biomedical Equipment

Biocompatible, chemically inert, and resistant to sterilizing procedures, alumina substrates find use in medical equipment and biomedical devices.

Products for Industry

They function as parts in equipment, pumps, and valves that need to be resistant to wear, electrical insulation, and hostile conditions.

 

Dimensions

Thickness

A few hundred micrometres (µm) to several millimetres (mm) are the usual range of thicknesses available for 99.6% alumina substrates. The mechanical and thermal specifications of the particular use will determine the thickness to use. Where weight and space are important, thinner substrates are often employed; larger substrates provide more mechanical strength.

Length and Width

99.6% alumina substrates may have rather different length and breadth measurements depending on the functional requirements and size restrictions of the application. Standard sizes vary from few millimeter squares or rectangles to tens of centimeter tiles or panels. For integration into finished goods and compliance with production equipment, certain dimensions are essential.

Shapes

Standard forms of 99.6% alumina substrates are produced to meet the needs of various applications:

Rectangular

The most often occurring forms for alumina substrates are rectangular. They have a great deal of uses in electronics, semiconductor production, and industrial components. Handling is made easy and rectangular substrates work with common machining procedures.
Additionally common are square alumina substrates, particularly in uses where symmetry and regularity are beneficial. They find frequent use in optical and electrical components, where their square forms make exact alignment and assembly easier.

Circle

Applications calling for rotational symmetry or needing component mounting around a central axis find utility for circular alumina substrates. These are widely used in high-precision machinery and equipment components like bearings, seals, and insulators.

Special Shapes

99.6% alumina substrates are available in typical forms as well as in a variety of geometries to suit particular design specifications. These might be hexagonal, octagonal, or irregular forms designed for particular uses in renewable energy systems, medical equipment, and aircraft.

 

Precision and Tolerance

Production of 99.6% alumina substrates depends critically on precise dimensions and close tolerances:

Precision in Dimensions

To guarantee consistency and compatibility with mating parts and equipment, manufacturers follow tight dimensional tolerances. Acquiring exact dimensions and flawless surface finishes requires the use of high-precision machining methods like grinding, polishing, and laser cutting.

Measurement of Geometry

Performance optimization in applications needing high mechanical stability, thermal conductivity, and electrical insulation depends on control over geometric properties including flatness, parallelism, and edge quality.

Alumina ceramic substrate is extensively used as a substrate material in the radio frequency microwave electronics industry. Its high dielectric constant allows for circuit miniaturization. It has excellent thermal stability and low temperature drift. Additionally, it possesses high strength and exceptional chemical stability, and its performance is superior to that of most other oxide materials, making it suitable for various thick film circuits, thin film circuits, hybrid circuits, microwave component modules, etc.

 

Alumina ceramic substrates can conduct circuit processing based on thin film photolithography, and their accuracy can reach the micron level. Many passive devices can be designed based on alumina ceramic substrates. Because their dielectric constant is greater than that of ordinary PCB substrates, the device being designed is small in size, which is advantageous in the growing trend of miniaturization of numerous component modules. Alumina ceramic substrates contribute significantly to the development of microwave RF:

- Thin film microstrip circuit;

- Thin film filter;

- Thin film loading;

- Thin film equalizer;

- Thin film power splitter;

- Thin film attenuator;

- Thin film coupler;

- Thin film bridge;

- Thin film resistor;

- Thin film capacitor.

99.6% alumina substrate possesses comprehensive properties of outstanding strength, good thermal conductivity, and stable electrical insulation. It is suitable for thin film and thick film metalization, and is cost-effective when compared to other ceramic materials.

99.6% Alumina Substrate Thin Film

99.6% alumina ceramic substrate is frequently used as the substrate material for thin film technology. The thin film process involves generating a metal layer on the surface of the ceramic substrate using techniques like magnetron sputtering, vacuum evaporation, and electrochemical deposition, and then forming specific metal patterns through techniques of masking and etching, etc. This process has the advantages of low working temperature, excellent wiring precision, controlled metal layer thickness, and high metal-ceramic bonding strength. Thin film ceramic substrates are primarily utilized in the packaging of devices with low current, small dimension, high heat dissipation, and high wiring precision requirements.

 

Unipretec offers full-process services from laser drilling, sputtering, evaporation, photolithography, electroplating, etching, cutting to inspection and marking. In addition, rapid prototyping and mass manufacturing are also available. A typical proofing cycle lasts seven days.

- Substrate

Material 99.6% Aluminum Oxide, Aluminum Nitride
Dimension 1-6 inches square or round
Thickness 0.1-2mm

- Metal

Sputtering Ti, TiW, TaN, Au, NiCr, Cu, Ni, Cr, Pt
Electroplating Cu, Ni, Au, Pt, AuSn
Evaporating AuSn, Pt

- Conductor

Line Width / Line Spacing Normal ≥20um, minimum 10um
Line Width/Line Spacing Accuracy ±3um

 

• Metalized Holes/Glooves

Hollow holes and solid holes can be realized, as well as side cladding metallization.

• Machining

Laser drilling, cutting, scribing and grinding wheel cutting can be realized, and the processing capabilities are shown below:

• Assembly

- Adhesive, wire welding, strip welding;

- Brazing (tin-lead, tin-silver-copper, indium-lead-silver);

- Eutectic soldering (gold-tin, gold-germanium).

• General Inspection Item

• Other Inspection Item

- Film Adhesion: 3M tape pulling method, full inspection; 100-square knife + 3M tape pulling method, accompanying film inspection;

- Appearance Quality: GJB548B-2005 method 2032, full inspection.

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