Al2O3 Substrate

Al2O3 substrates are now the most established ceramic substrates in terms of manufacturing and processing technology. Unipretec provides al2o3 substrates with alumina concentration of 96%. Due to their exceptional electrical, mechanical, and chemical properties, they are extensively used. We use laser cutting to produce all of our substrates. They are available in standard sizes or can be cut to custom designs for prototypes or series production.

Tags Al2O3 Substrate

Al2O3 substrate offers excellent mechanical strength and chemical resistance. Additionally, it can be employed to support and isolate conducting parts as an electrical insulator. It exhibits excellent thermal stability in high-temperature and high-power applications.

Benefits of Al2O3 Substrate

-High hardness and mechanical strength;

-Can endure a wide temperature range without degrading its performance significantly;

-High chemical resistance that can maintain stable in a variety of corrosive environments;

-Excellent electrical insulator, guaranteeing normal operation and safety of electronic circuits;

-Low dielectric loss;

-Outstanding flatness and surface finish;

-Cost-effective, making them an appealing solution for a variety of applications.

Standard Sizes of Al2O3 Substrate

Unipretec provides al2o3 substrates ranging in thickness from 0.015" (0.381mm) to 0.100" (2.54mm). Thicknesses ranging from 0.025" (0.635 mm) to 0.040" (1.016 mm) are the most economical. The specific dimensions are as follows:

Customized dimensions are available. Unipretec can provide laser cutting services and manufacture custom shapes and holes.

Custom Machining of Al2O3 Substrate

Unipretec offers laser machining services. Laser machining is a non-contact processing method that is employed to cut, drill, and engrave Al2O3 substrates. It can also be used to create intricate shapes.

Additionally, substrates can be ground and lapped to obtain particular surface finishes and flatness. After grinding and lapping, surface roughness can typically reach Ra0.3-0.6um. Unipretec offers polishing services, including single- or double-sided polishing with surface roughness Ra 0.05-0.10um, for improved surface roughness.

Principal Characteristics of Substrates of Aluminum Oxide

High Hardness and Mechanical Strength

Al2O3 substrates have strong mechanical and wear resistance. Applications requiring large mechanical loads and abrasive environments depend heavily on this characteristic.

Superb Thermal Stability

Up to 1600°C is the usual maximum temperature at which aluminum oxide may be used without losing its qualities. Application in high-temperature conditions need this thermal resilience.

Electrical Insulation

Having low electrical conductivity and great dielectric strength, Al2O3 is a superb electrical insulator. That qualifies it for use in electronic applications requiring electrical isolation.

Chemical Resistance

Acids, alkalis, and other strong chemicals do not readily corrode Al2O3 substrates. Their lifespan and durability in chemically hostile conditions are so guaranteed.

Low Thermal Expansion

Precision parts need dimensional stability under temperature variations, which is maintained in part by aluminum oxide's low coefficient of thermal expansion.

good thermal conductivity

Strong thermal conductivity of Al2O3 substrates facilitates effective heat dissipation in electronic equipment.

Uses of Aluminum Oxide Substrates

Electronics

Al2O3 substrates have extensive use in power electronics, hybrid microelectronics, and integrated circuits. Reliability and performance of electronic equipment depend on their electrical insulation and thermal management qualities.

Aerospace

In the aerospace sector, Al2O3 substrates are utilized in insulating materials and thermal barriers, among other components that need for high-temperature resistance and mechanical strength.

Medical Devices

Because it is durable, chemically resistant, and biocompatible, aluminum oxide finds use in medical equipment. Applications include diagnostic equipment, dental implants, and surgical tools.

Engine Electronics

Al2O3 substrates are utilized in engine control units and sensors, among other automotive electronics where dependable functioning depends on electrical insulation and thermal management.

Uses in Industry

Al2O3 substrates' hardness and chemical resistance find usage in industrial machinery applications including mechanical seals, cutting tools, and wear-resistant components.

Telecommunications

Signal integrity and performance are improved in high-frequency circuits of telecommunications equipment by the electrical insulation and thermal management features of Al2O3 substrates.

Production Methods of Al2O3 Substrates

Al2O3 substrate production entails a number of complex procedures to obtain the required material characteristics:

Powder Preparation

Aluminum oxide powder of high purity is usually produced by synthesising from aluminum salts or by the Bayer process. The powder is meticulously milled to the purity and distribution of particle sizes that are desired.

Forming

A uniform slurry or paste is created by combining the Al2O3 powder with binders and additives. Then, using a variety of methods including tape casting, dry pressing, or injection moulding, this mixture is formed into the required shape. The resulting forms, called green bodies, are then dried to drive out moisture.

A sinter

The dried green bodies are heated in a controlled atmosphere to high temperatures (usually above 1500°C) during the sintering process. The alumina particles join together during sintering to give the material its final mechanical and thermal characteristics and to densify it.

Machinery and Finishing

Al2O3 substrates are precision machiningd after sintering to produce smooth surface finishes and close dimensional tolerances by means of grinding, lapping, and polishing. Applications of metallization procedures can also be made to improve bonding with other materials or electrical conductivity.

Al2O3 substrates offer advantages of low dielectric loss, great mechanical strength, and excellent chemical stability. They are primarily employed in the medium- and low-power fields currently, including general power electronics, concentrated solar energy, Peltier components (thermoelectric semiconductor cooling devices), semiconductor modules for automotive applications, etc.

Alumina Substrate for Chip Resistors

The advantages of an alumina ceramic substrate resistor include its small size, light weight, low thermal expansion coefficient, good dependability, high thermal conductivity and density, all of which contribute to the circuit's reliability and wiring density. It serves as the chip resistance element's carrier material.

Alumina Substrates for Hybrid Integrated Circuits

A hybrid integrated circuit is a type of packaging that includes at least two components, with one of which is an active component. Install them on a thick film or thin film processed metal conduction tape insulating sheet, and the complicated circuit produced by this technology is a hybrid integrated circuit. The substrate serves as a mechanical support for the circuit and offers a deposition area for the resistive, dielectric, and conduction band materials that make up passive components. For all passive and active chip components, it also functions as a mechanical support.

Common substrates for hybrid integrated circuits are alumina, beryllium oxide, silicon oxide, and aluminium nitride. However, high-purity alumina substrates with smooth surfaces are frequently employed when cost and performance are taken into account. The grade and quality of the substrate differ due to the difference in alumina content. The two most popular ones are 99.6% and 96% alumina. The former is typically appropriate for thin film circuits, whereas 96% alumina substrates are well-suited for thick film circuits because they can fulfil the particular technological needs. Alumina ceramic green sheets with 96% Al2O3 concentration are typically the basic material for multilayer co-firing alumina ceramics.

Power Device Substrate

In addition to the fundamental wiring (electrical interconnection) function, the substrate for the packaging of power electronic devices must have high thermal conductivity, insulating property, heat resistance, voltage resistance, and thermal matching performance. The metallized ceramic substrates represented by DBC and DPC exhibit outstanding thermal conductivity, insulation, voltage resistance, and heat resistance, and have steadily gained market acceptance as the preferable material for power device packaging. Al2O3 substrate is the most common substrate material used for device packaging. The Al2O3 substrate technology is well developed, and the price is low.

Al2O3 Substrate for LED

Ceramic substrates make up the majority of high-power LED heat dissipation substrates. LTCC (low temperature co-fired ceramics) and DPC (direct plated copper) are the two types of high-power ceramic substrates available on the market, and the ceramic materials include alumina and aluminium nitride. The luminous efficiency and lifespan of LEDs can be increased because of the superior heat dissipation and air tightness of Al2O3 substrates. They are highly weather-resistant and suitable for use in a variety of conditions due to their excellent air tightness.

Although Al2O3 substrate is currently the most developed ceramic substrate material, its thermal conductivity is low; for example, the thermal conductivity of 96 al2o3 substrate is only 24W/ (m.K). Furthermore, the thermal expansion coefficient of Al2O3 is considerably different from that of chip materials such as Si and SiC, which makes it easy to accumulate internal stress during the cold and heat cycle, increasing the likelihood of chip failure. It is challenging for al2o3 substrates to adapt to the development trend of high-power devices due to the aforementioned factors.

Alumina ceramics possess exceptional mechanical, thermal, chemical, and dielectric properties, with varying alumina contents resulting in different performance and costs. Alumina substrates are frequently laser machined and can be ground and polished to particular surface finishes, allowing them to be used in a wide range of electronic device packaging.

Al2O3 Substrate for Thick Film

For thick film printing applications requiring thermal management, alumina substrates are always the top choice. Before drying and baking, the circuits are screen printed onto the surface. Thick film means that the thickness of the printed lines or traces is about 10-20um, which is merely thick in comparison to another type of electronics known as "thin film circuits."

Thick film substrates offer superior heat management for four primary reasons:

High Thermal Conductivity

High thermal conductivity allows heat to flow away from the heat source more quickly, reducing the generation of hot spots to the utmost extent.

Low Thermal Expansion Coefficient

As a result of the low coefficient of thermal expansion, more energy is needed to create the same quantity of expansion. Consequently, there is less stress on the ceramic substrate.

Low Vias Use Frequency

Vias are less frequently employed, despite the fact that an al2o3 substrate can print circuits with up to 11 layers. This eliminates the most prevalent source of cracks.

Don't Soften or Burn

Alumina ceramics will not soften or burn, making them the only practical option for applications involving extremely high temperatures.

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Alumina (Al2O3)

Alumium Niride (AlN)

Boron Nitride (Hex BN)

Machinable Glass Ceramic

Silicon Nitride (Si3N4)

Zirconia (ZrO2)

Al2O3 Substrate

Al2O3 Substrate

Benefits of Al2O3 Substrate

Standard Sizes of Al2O3 Substrate

Custom Machining of Al2O3 Substrate

Principal Characteristics of Substrates of Aluminum Oxide

High Hardness and Mechanical Strength

Superb Thermal Stability

Electrical Insulation

Chemical Resistance

Low Thermal Expansion

good thermal conductivity

Uses of Aluminum Oxide Substrates

Electronics

Aerospace

Medical Devices

Engine Electronics

Uses in Industry

Telecommunications

Production Methods of Al2O3 Substrates

Powder Preparation

Forming

A sinter

Machinery and Finishing

Alumina Substrate for Chip Resistors

Alumina Substrates for Hybrid Integrated Circuits

Power Device Substrate

Al2O3 Substrate for LED