DBC ceramic substrate possesses the distinctive ceramic properties of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion. Additionally, it combines outstanding solderability and high conductivity of oxygen-free copper, enabling the etching of a variety of patterns.
Characteristics of DBC Ceramic Substrate
1. Outstanding Insulation
The chip is effectively isolated from the heat dissipation base of the module using the DBC ceramic substrate as the chip carrier. The Al2O3 ceramic layer or AlN ceramic layer in DBC substrate improves the module's insulation capability (insulation voltage >2.5KV).
2. High Thermal Conductivity
Ceramic substrates provide excellent thermal conductivity, with 24 W/m.K for Al2O3 and 180 W/m.K for AIN. When operating the IGBT module, a considerable amount of heat is generated on the surface of the chip. This heat can be successfully transferred to the module's heat dissipation base via the DBC substrate, and then to the radiator through the thermal conductive silicone grease to achieve overall heat dissipation of the module.
3. Thermal Expansion Coefficient Similar to Silicon
DBC ceramic substrates have a thermal expansion coefficient similar to that of silicon (the primary component of the chip), with 6.8 ppm for AL2O3 and 4.0 ppm for AIN. This resemblance keeps stress from harming the chip. DBC ceramic substrates are ideal for a variety of temperature applications because of their superior mechanical characteristics, resistance to corrosion, and minimal deformation.
4. Good Mechanical Strength
Thick copper foil and high-performance ceramic materials provide the DBC ceramic substrate with excellent mechanical strength and dependability.
5. High Current-Carrying Capability
Due to the superior electrical properties and high current-carrying capability of copper conductors, DBC ceramic substrates can support high power capacity, which depends on the thickness of copper: 0.12mm, 0.2mm, 0.3mm, and 0.4mm.
6. Low Inking Rate and High Quality Consistency
7. Low Metal or Ceramic Particle Contamination
Application fields of DBC substrates
In the field of power electronics, DBC substrates are widely used for heat dissipation of power modules such as IGBT and MOSFET. The LED lighting industry also uses DBC substrates in large quantities to improve the heat dissipation efficiency and service life of lamps. In addition, DBC ceramic substrates are also widely used in high-end fields such as sensors, automotive electronics, and aerospace. These fields have extremely high requirements for the high temperature resistance, corrosion resistance, and reliability of materials, and DBC ceramic substrates just meet these needs.
Size and shape
DBC ceramic substrates are tailored in size and form to satisfy the heat dissipation and packaging needs of various electronic devices. As per the information Rogers supplied, the maximum possible area on the ceramic plate for DBC and AMB substrates is typically 5 inches by 7 inches (127 mm by 178 mm). About the minimal size, it may sometimes be as little as 15 mm. This indicates that DBC ceramic substrates may be sized somewhat flexible and used in a range of applications.
DBC ceramic substrates come in a range of forms to suit certain layout and assembly specifications for electronic components. Regular forms include squares, rectangles, and other special shapes. Apart from the conventional rectangular boards, other shapes may also be made to suit the needs of the circuit design and installation, like notched or certain contoured designs to improve heat management or accommodate space limitations.
Is DBC ceramic substrate heavy?
DBC ceramic substrates are not as heavy as standard metal substrates are. The ceramic material itself is comparatively light weighted and has great wear resistance and toughness. Because of its usually thin thickness, the DBC ceramic substrate is rather light overall, even when paired with a copper layer, even though copper has a certain weight.
DBC ceramic substrates are also the best option in applications where weight considerations are important, like portable electronic devices, automobile electronics, aircraft, etc., because of their lightweight properties. Reduced weight of the gadget as a whole enhances performance and energy efficiency.
Still, the particular weight is also influenced by the substrate's size and thickness as well as the copper layer's thickness. The best specifications for DBC ceramic substrates may be chosen and designed by considering the application needs to balance weight with necessary performance criteria like mechanical strength and thermal management.
